Fidelity’s Huang begs for wafers as fabs hit their limits

TSMC’s latest sports day turned into something of a customer summit when Fidelity boss Huang Renxun publicly pleaded for more chip supply, declaring that “without TSMC, there would be no Fidelity.”

Significant power, performance, and density improvements

TSMC has revealed further details about its N2 (2nm-class) fabrication process at the IEEE International Electron Device Meeting (IEDM).

Will be ready for volume production

Despite having its CEO behind bars, Samsung will be ready for volume production of its 7nm process node in 2018.