Nvidia happy for now

The Trump administration has torched the Biden-era “AI Diffusion Rule” just days before it was set to take effect on 15 May. The rule, described by a Commerce Department official as “overly complex, bureaucratic, and would stymie American innovation,” carved up the globe into chip access tiers.

SoftBank’s silicon darling stumbles as Washington jitters mount

British chip designer Arm took a knock on 8 May, warning that trade uncertainty has fogged up its revenue crystal ball..

Windows 11 getting more AI tools than you can poke a stick at

The Software King of the World, Microsoft is flooding Windows 11 with new AI tools but only Copilot+ PCs with Snapdragon X chips can run them, with Intel and AMD hardware coming later.

B-series card coming for the H100’s memory crown

Nvidia has chucked naming convention out the window and launched the RTX Pro 6000 Blackwell family at GTC 2025, ditching the B40 branding you’d expect from a successor to the A40, L40, and L40S.

Tim Cook reckons the “personal Siri” only half-baked

The Fruity Cargo Cult Apple’s much-hyped “Apple Intelligence” revamp of Siri is struggling to remember its lines, with company boss Tim Cook telling the cocaine nose jobs of Wall Street that it is still nowhere near ready for showtime.

Chipzilla’s CEO Lip-Bu Tan leans into realism

Troubled Chipzilla is stretching its long-promised 18A process into two new variants aimed at feeding the AI beast and mainstream punters.

US diffusion rules target even friendly nations

New US export rules are about to hammer Nvidia’s artificial intelligence chip business far beyond China.

New GPU plugs gaps left by banned H20 chips

Nvidia is pushing production of its new B300 AI chip forward to May, using Taiwan Semiconductor Manufacturing’s latest 5nm (N4P) process and CoWoS-L advanced packaging technology.

China’s tech champion aims to fill gaps left by US sanctions

Huawei is preparing to test its latest AI chip, the Ascend 910D, hoping it can challenge higher-end products from Nvidia as US restrictions batter the Chinese semiconductor industry.

Chip packaging just got absurdly massive

TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an obscene amount of silicon into a single unit.