Speaking at a corporate briefing, Xie said customers have started placing orders earlier than usual, thanks to global trade spats and tariff roulette. He warned, however, that the US government’s tech policies and its obsession with tariff tinkering could still throw a spanner in the works.

In DRAM, he reckons the AI wave and new hardware launches will lift demand. Even non-AI servers are finally getting upgraded, which should give DRAM packaging a second wind.

NAND flash and SSD orders are heading north, pushed along by new mobile kit and heavier SSD use in data centres. Xie thinks this momentum will carry into early 2026 without the usual post-holiday dip.

On the logic side, PTI is cashing in on customers shifting orders, and the firm is seeing early wins in high-end flip-chip ball grid array (FC-BGA) packaging. Fan-out panel level packaging (FOPLP) is also making progress, with better yields and a ramp-up in capacity.

PTI plans to push FOPLP packaging into the server space, while also testing the waters for edge computing hardware. Xie hopes this will open up more revenue streams as demand diversifies.

Meanwhile, its Japanese outfits Tera Probe and TeraPower are holding steady. Fourth-quarter revenue looks stable, and the pair are ramping up R&D and spending for AI, high-performance computing and fancy driver assistance tech. Capex for 2025 is expected to hit around NT$50.6 billion, with next year’s outlay jumping to $2.5 billion (€2.35 billion).

PTI’s investment in Chaofeng Electronics is starting to pay off. Xie said AI-related demand for high-speed transmission and power components continues to grow. Flip-chip packaging and testing volumes are also ticking up each quarter.