Instead of having a chip that breaks when flexed, their new chip material stretches out.

They’ve taken the humble metamaterial and given it a Michelin-star twist. Combining a grid of trusses with a coil-filled noodle network has essentially turned a microchip into a lasagne of layered elasticity. The technique involves two-photon lithography.

Professor Carlos Portela stirred the pot, saying, “Think of this woven network as a mess of spaghetti tangled around a lattice… now all this spaghetti gets entangled with the lattice pieces.”

It’s not the first time spaghetti has caused structural chaos, but it’s probably the first time it’s done so for tech.

When put through the rigatoni ringer (technically a nanomechanical press), the chip’s new double-layer design stretched over three times its length without boiling over. That’s impressive for a material more used to cracking under pressure than rolling with the punches.

Flexible semiconductors could finally become more than a half-baked gimmick. From mobile devices to bendy motherboards, MIT’s new approach could mean electronics that stretch without splitting like an overfilled raviolo.

This isn’t just another flash in the pan. MIT thinks the same spaghetti logic could apply to glass, ceramics and metals. Imagine unbreakable phones, laptops that don’t bow like a wet pizza box, or smart textiles that take a tumble and still work. It’s the tortellini of tech dreams: stuffed with potential and holding its shape under stress.

Of course it will not be open sauce.